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 MBR230LSFT1 Surface Mount Schottky Power Rectifier
Plastic SOD-123 Package
This device uses the Schottky Barrier principle with a large area metal-to-silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC-DC and DC-DC converters, reverse battery protection, and "Oring" of multiple supply voltages and any other application where performance and size are critical.
Features http://onsemi.com
SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES, 30 VOLTS
* * * * * * * * * * * * * * *
Guardring for Stress Protection Low Forward Voltage 125C Operating Junction Temperature Epoxy Meets UL 94 V-0 Package Designed for Optimal Automated Board Assembly ESD Ratings: Machine Model, C Human Body Model, 3B This is a Pb-Free Device
SOD-123FL CASE 498 PLASTIC
MARKING DIAGRAM
L3N MG G
Mechanical Characteristics
Reel Options: MBR230LSFT1 = 3,000 per 7 in reel/8 mm tape Device Marking: L3N Polarity Designator: Cathode Band Weight: 11.7 mg (approximately) Case: Epoxy, Molded Lead Finish: 100% Matte Sn (Tin) Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Device Meets MSL 1 Requirements
L3N = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping 3000/Tape & Reel
MBR230LSFT1G SOD-123FL (Pb-Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2007
1
May, 2007 - Rev. 0
Publication Order Number: MBR230LSFT1/D
MBR230LSFT1
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 105C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TL = 95C) Non-Repetitive Peak Surge Current (Non-Repetitive peak surge current, halfwave, single phase, 60 Hz) Storage Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFRM IFSM Tstg TJ dv/dt Value 30 Unit V
2.0 4.0 40 -55 to 150 -55 to 125 10,000
A A A C C V/ms
THERMAL CHARACTERISTICS
Thermal Thermal Thermal Thermal Resistance, Resistance, Resistance, Resistance, Junction-to-Lead (Note 1) Junction-to-Lead (Note 2) Junction-to-Ambient (Note 1) Junction-to-Ambient (Note 2) Rtjl Rtjl Rtja Rtja 26 21 325 82 C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Mounted with minimum recommended pad size, PC Board FR4. 2. Mounted with 1 in. copper pad (Cu area 700 mm2).
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3) (IF = 1.0 A) (IF = 2.0 A) Maximum Instantaneous Reverse Current (Note 3) (VR = 30 V) 3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2%. IR VF TJ = 25C 0.38 0.43 TJ = 25C 1.0 TJ = 100C 0.30 0.37 TJ = 100C 25 mA V
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2
MBR230LSFT1
TYPICAL CHARACTERISTICS
10 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10
1
TJ = 125C TJ = 100C TJ = 25C TJ = -55C 0.20 0.30 0.40 0.50 0.60 0.70 0.80
1 T = 125C J TJ = 100C
0.1 0.10
0.1 0.10
TJ = 25C 0.20 0.30 0.40
TJ = -55C 0.50 0.60 0.70
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
IR, MAXIMUM REVERSE CURRENT (AMPS)
100E-3 IR, REVERSE CURRENT (AMPS) 10E-3 1E-3
1E+0
TJ = 125C TJ = 100C
100E-3
TJ = 125C
100E-6 10E-6 1E-6 TJ = -55C TJ = 25C
10E-3 TJ = 100C 1E-3 TJ = 25C
100E-9 10E-9 1E-9 0
100E-6 TJ = -55C 10E-6 0 10 20 VR, REVERSE VOLTAGE (VOLTS) 30
10 20 VR, REVERSE VOLTAGE (VOLTS)
30
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
IO, AVERAGE FORWARD CURRENT (AMPS)
3.5 3 2.5 2 1.5 1 0.5 0 25 35 45 55 65 75 85 95 105 115 125 freq = 20 kHz square wave Ipk/IO = p Ipk/IO = 5 dc
PFO, AVERAGE POWER DISSIPATION (WATTS)
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 square wave Ipk/IO = p Ipk/IO = 5 dc
TL, LEAD TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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3
MBR230LSFT1
TYPICAL CHARACTERISTICS
TJ, DERATED OPERATING TEMPERATURE (C)
1000
TJ = 25 C
125 120 115 110 105 100 95 90 85 80 75 70 65
RqJA = 25.6 C/W
C, CAPACITANCE (pF)
RqJA = 130 C/W
100
RqJA = 235 C/W RqJA = 324.9 C/W RqJA = 400 C/W 0 2 4 6 8 10 12 14 16 VR, DC REVERSE VOLTAGE (VOLTS) 18 20
10
0
5
10 15 20 25 VR, REVERSE VOLTAGE (VOLTS)
30
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating
r(t), TRANSIENT THERMAL RESISTANCE
1000 D = 0.5 100 0.2 0.1 0.05 P(pk) 0.01 1 SINGLE PULSE Test Type > Min Pad < Die Size 38x38 @ 75% mils 0.1 0.000001 0.00001 0.0001 0.001 0.01 t1, TIME (sec) 0.1 1 10 100 1000 t1 t2 DUTY CYCLE, D = t1/t2 qJA = 321.8 C/W
10
Figure 9. Thermal Response
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4
MBR230LSFT1
PACKAGE DIMENSIONS
SOD-123LF CASE 498-01 ISSUE A
E q
D A1 A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. 4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. MILLIMETERS NOM MAX 0.95 1.00 0.05 0.10 0.90 1.10 0.15 0.20 1.65 1.80 2.70 2.90 0.75 0.95 3.60 3.80 8 INCHES NOM 0.037 0.002 0.035 0.006 0.065 0.106 0.030 0.142 -
POLARITY INDICATOR OPTIONAL AS NEEDED
L
b
DIM A A1 b c D E L HE q
MIN 0.90 0.00 0.70 0.10 1.50 2.50 0.55 3.40 0
MIN 0.035 0.000 0.028 0.004 0.059 0.098 0.022 0.134 0
MAX 0.039 0.004 0.043 0.008 0.071 0.114 0.037 0.150 8
HE
q
c
SOLDERING FOOTPRINT*
0.91 0.036
2.36 0.093 4.19 0.165
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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5
EE EE EE
EE EE EE
1.22 0.048
SCALE 10:1
mm inches
MBR230LSFT1/D


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